At NXP, he led RFID technology initiatives as Product Manager, aligning product development with emerging market demands. He continued to shape innovation and business growth at AVL, where he held global responsibility for consumption measurement devices and drove strategic direction as Business Segment Manager. At ams OSRAM, Michael led product management, system innovation, and public R&D funding initiatives, driving growth opportunities, advancing sensor innovation, and building strong collaborations with industry and academia. Today, he leads the AT-C³ Chips Competence Center at the SILICON ALPS Cluster.

Photo: Toni Muhr

Photo: Studio Lou

Photo: mar

I am a scientist at Silicon Austria Labs, where I contribute to research in microelectronics and embedded artificial intelligence. I hold a PhD in Electrical Engineering, specializing in digital integrated circuits design. At SAL, I am currently involved in several work packages of the EuroCDP project, one of them in charge of stablishing and nurture strategic synergies with EU initiatives and international semiconductor programs. Photo: Silicon Austria Labs

Dr. Jan Preibisch is VP Corporate Strategy at AT&S in Leoben, Austria, shaping strategic direction in advanced electronics and IC substrates. With a Ph.D. in Electrical Engineering from TU Hamburg and more than 10 years’ experience in the semiconductor industry, he brings deep technical insight and market expertise. Jan has contributed to award-winning research and speaks regularly at industry events, sharing practical perspectives on innovation, strategy, and emerging trends. Photo: Christoph Heigl

Mr Paing has a substantial international (15 years abroad) and mixed public/private experience in private companies (Orange, Sagemcom), in the French Ministry of Foreign Affairs (scientific attaché in Taiwan in 1998-1999 and in Hanoi, Vietnam from 2002 to 2005) and in CEA since 2005. He first promoted MINATEC innovation campus in Grenoble and then became CEA-Leti VP Industrial Partnerships to develop R&D programs with Industry. He also developed R&D partnerships with Japanese and American companies in Tokyo and California (Caltech, Pasadena) from 2013 to 2021, and then became International Relations Deputy Director at CEA Head Office in Paris-Saclay from 2021 to 2023.

Since my master degree in European Affairs,I have built my career at the crossroads of European microelectronics, innovation networks, and digital transformation. With strong experience in collaborative ecosystems such as EPoSS (European Technology Platform on Smart Systems), I have worked extensively in networking, consulting, and the design and management of major European projects within Minalogic (like eDIHs). I am also actively engaged in the aCCCess project, where I lead Focus Group 3 on Technology, and contribute to shaping the French Chips Competence Centre Asteerics, bridging technology, policy, and industry needs.